Reference circuitry

To ensure good RF performance when designing PCBs, it is highly recommended to use the PCB layouts and component values provided by Nordic Semiconductor.

Documentation for the different package reference circuits, including Altium Designer files, PCB layout files, and PCB production files can be downloaded from the product page for the nRF52820 on www.nordicsemi.com.

In this section there are reference circuits for QDAA QFN40 package, and CFAA WLCSP, showing the components and component values to support on-chip features in a design.

Note: This is not a complete list of configurations, but all required circuitry is shown for further configurations.
Some general guidance is summarized here:
  • When supplying power from a USB source only, VBUS must be connected to VDDH if USB is to be used.
  • Components required for DC/DC function are only needed if DC/DC mode is enabled for that regulator.
  • USB can be used in any configuration as long as VBUS is supplied by the USB host.
  • The schematics include an optional series resistor on the USB supply for improved immunity to transient overvoltage during VBUS connection. Using the series resistor is recommended for new designs.

Circuit configurations for QDAA QFN40

Table 1. Circuit configurations
Config no.Supply configurationFeatures that can be enabled for each configuration example
VDDHVDDDCDCEN1USB
Config. 1USB (VDDH = VBUS)N/ANoYes
Config. 2N/ABattery/Ext. regulatorYesYes
Config. 3N/ABattery/Ext. regulatorNoYes
Config. 4N/ABattery/Ext. regulatorNoNo

Circuit configurations for CFAA WLCSP

Table 2. Circuit configurations
Config no.Supply configurationFeatures that can be enabled for each configuration example
VDDHVDDDCDCEN1USB
Config. 1USB (VDDH = VBUS)N/ANoYes
Config. 2N/ABattery/Ext. regulatorYesYes
Config. 3N/ABattery/Ext. regulatorNoYes
Config. 4N/ABattery/Ext. regulatorNoNo

Circuit configuration no. 1 for QDAA QFN40

This section contains a configuration summary, a schematic, and bill of materials table for QDAA QFN40 circuit configuration number 1.

Table 3. Configuration summary for circuit configuration no. 1
Config no.Supply configurationEnabled features
VDDHVDDDCDCEN1USB
Config. 1USB (VDDH = VBUS)N/ANoYes
Figure 1. Circuit configuration no. 1 schematic for QDAA QFN40


Note: For PCB reference layouts, see the product page for the nRF52820 on www.nordicsemi.com.
Table 4. Bill of material for circuit configuration no. 1
DesignatorValueDescriptionFootprint
C1, C2, C15, C1612 pFCapacitor, NP0, ±2%0201
C31.0 pFCapacitor, NP0, ±5%0201
C41.2 pFCapacitor, NP0, ±5%0201
C5, C7, C11100 nFCapacitor, X7S, ±10%0201
C6, C194.7 µFCapacitor, X7R, ±10%0603
C8820 pF

Capacitor, X7R, ±10%

Not required for Dxx and later

0201
C9N.C.Not mounted0201
C10100 pFCapacitor, NP0, ±5%0201
C12, C131.0 µFCapacitor, X7S, ±10%0402
C174.7 µFCapacitor, X7S, ±10%0603
L14.7 nHHigh frequency chip inductor, ±5%0201
L22.2 nHHigh frequency chip inductor, ±5%0201
R12R2Resistor ±1%, 0.05 W0201
U1nRF52820-QDAAMultiprotocol Bluetooth® Low Energy, IEEE 802.15.4, ANT, and 2.4 GHz proprietary System on ChipQFN-40
X132 MHzCrystal SMD 1612, 32 MHz, Cl=8 pF, Total Tol: ±40 ppmXTAL_1612
X232.768 kHzCrystal SMD 2012, 32.768 kHz, Cl=9 pF, Total Tol: ±50 ppmXTAL_2012

Circuit configuration no. 2 for QDAA QFN40

This section contains a configuration summary, a schematic, and bill of materials table for QDAA QFN40 circuit configuration number 2.

Table 5. Configuration summary for circuit configuration no. 2
Config no.Supply configurationEnabled features
VDDHVDDDCDCEN1USB
Config. 2N/ABattery/Ext. regulatorYesYes
Figure 2. Circuit configuration no. 2 schematic for QDAA QFN40


Note: For PCB reference layouts, see the product page for the nRF52820 on www.nordicsemi.com.
Table 6. Bill of material for circuit configuration no. 2
DesignatorValueDescriptionFootprint
C1, C2, C15, C1612 pFCapacitor, NP0, ±2%0201
C31.0 pFCapacitor, NP0, ±5%0201
C41.2 pFCapacitor, NP0, ±5%0201
C5, C7, C11100 nFCapacitor, X7S, ±10%0201
C6, C194.7 µFCapacitor, X7R, ±10%0603
C8820 pF

Capacitor, X7R, ±10%

Not required for Dxx and later

0201
C9N.C.Not mounted0201
C10100 pFCapacitor, NP0, ±5%0201
C12, C131.0 µFCapacitor, X7S, ±10%0402
C1447 nFCapacitor, X7S, ±10%0201
C184.7 µFCapacitor, X7S, ±10%0603
L14.7 nHHigh frequency chip inductor, ±5%0201
L22.2 nHHigh frequency chip inductor, ±5%0201
L310 µHChip inductor, IDC,min = 50 mA, ±20%0603
L415 nHHigh frequency chip inductor, ±10%0402
U1nRF52820-QDAAMultiprotocol Bluetooth Low Energy, IEEE 802.15.4, ANT, and 2.4 GHz proprietary System on ChipQFN-40
X132 MHzCrystal SMD 1612, 32 MHz, Cl=8 pF, Total Tol: ±40 ppmXTAL_1612
X232.768 kHzCrystal SMD 2012, 32.768 kHz, Cl=9 pF, Total Tol: ±50 ppmXTAL_2012

Circuit configuration no. 3 for QDAA QFN40

This section contains a configuration summary, a schematic, and bill of materials table for QDAA QFN40 circuit configuration number 3.

Table 7. Configuration summary for circuit configuration no. 3
Config no.Supply configurationEnabled features
VDDHVDDDCDCEN1USB
Config. 3N/ABattery/Ext. regulatorNoYes
Figure 3. Circuit configuration no. 3 schematic for QDAA QFN40


Note: For PCB reference layouts, see the product page for the nRF52820 on www.nordicsemi.com.
Table 8. Bill of material for circuit configuration no. 3
DesignatorValueDescriptionFootprint
C1, C2, C15, C1612 pFCapacitor, NP0, ±2%0201
C31.0 pFCapacitor, NP0, ±5%0201
C41.2 pFCapacitor, NP0, ±5%0201
C5, C7, C11100 nFCapacitor, X7S, ±10%0201
C6, C194.7 µFCapacitor, X7R, ±10%0603
C8820 pF

Capacitor, X7R, ±10%

Not required for Dxx and later

0201
C9N.C.Not mounted0201
C10100 pFCapacitor, NP0, ±5%0201
C12, C131.0 µFCapacitor, X7S, ±10%0402
C184.7 µFCapacitor, X7S, ±10%0603
L14.7 nHHigh frequency chip inductor, ±5%0201
L22.2 nHHigh frequency chip inductor, ±5%0201
U1nRF52820-QDAAMultiprotocol Bluetooth Low Energy, IEEE 802.15.4, ANT, and 2.4 GHz proprietary System on ChipQFN-40
X132 MHzCrystal SMD 1612, 32 MHz, Cl=8 pF, Total Tol: ±40 ppmXTAL_1612
X232.768 kHzCrystal SMD 2012, 32.768 kHz, Cl=9 pF, Total Tol: ±50 ppmXTAL_2012

Circuit configuration no. 4 for QDAA QFN40

This section contains a configuration summary, a schematic, and bill of materials table for QDAA QFN40 circuit configuration number 4.

Table 9. Configuration summary for circuit configuration no. 4
Config no.Supply configurationEnabled features
VDDHVDDDCDCEN1USB
Config. 4N/ABattery/Ext. regulatorNoNo
Figure 4. Circuit configuration no. 4 schematic for QDAA QFN40


Note: For PCB reference layouts, see the product page for the nRF52820 on www.nordicsemi.com.
Table 10. Bill of material for circuit configuration no. 4
DesignatorValueDescriptionFootprint
C1, C2, C15, C1612 pFCapacitor, NP0, ±2%0201
C31.0 pFCapacitor, NP0, ±5%0201
C41.2 pFCapacitor, NP0, ±5%0201
C5, C7, C11100 nFCapacitor, X7S, ±10%0201
C64.7 µFCapacitor, X7R, ±10%0603
C8820 pF

Capacitor, X7R, ±10%

Not required for Dxx and later

0201
C9N.C.Not mounted0201
C10100 pFCapacitor, NP0, ±5%0201
C12, C131.0 µFCapacitor, X7S, ±10%0402
L14.7 nHHigh frequency chip inductor, ±5%0201
L22.2 nHHigh frequency chip inductor, ±5%0201
U1nRF52820-QDAAMultiprotocol Bluetooth Low Energy, IEEE 802.15.4, ANT, and 2.4 GHz proprietary System on ChipQFN-40
X132 MHzCrystal SMD 1612, 32 MHz, Cl=8 pF, Total Tol: ±40 ppmXTAL_1612
X232.768 kHzCrystal SMD 2012, 32.768 kHz, Cl=9 pF, Total Tol: ±50 ppmXTAL_2012

Circuit configuration no. 1 for CFAA WLCSP

This section contains a configuration summary, a schematic, and bill of materials table for CFAA WLCSP circuit configuration number 1.

Table 11. Configuration summary for circuit configuration no. 1
Config no.Supply configurationEnabled features
VDDHVDDDCDCEN1USB
Config. 1USB (VDDH = VBUS)N/ANoYes
Figure 5. Circuit configuration no. 1 schematic for CFAA WLCSP
Note: For PCB reference layouts, see the product page for the nRF52820 on www.nordicsemi.com.
Table 12. Bill of material for circuit configuration no. 1
DesignatorValueDescriptionFootprint
C1, C2, C11, C1212 pFCapacitor, NP0, ±2%0201
C31.0 pFCapacitor, NP0, ±5%0201
C4, C7100 nFCapacitor, X7S, ±10%0201
C5, C144.7 µFCapacitor, X7R, ±10%0603
C6820 pF

Capacitor, X7R, ±10%

Not required for Dxx and later

0201
C8, C91.0 µFCapacitor, X7S, ±10%0402
C134.7 µFCapacitor, X7S, ±10%0603
L13.9 nHHigh frequency chip inductor ±5%0201
L24.7 nHHigh frequency chip inductor ±5%0201
R12R2Resistor, ±1%, 0.05W0201
U1nRF52820-CFAAMultiprotocol Bluetooth Low Energy, IEEE 802.15.4, ANT, and 2.4 GHz proprietary System on ChipWLCSP-44
X132 MHzCrystal SMD 1612, 32 MHz, Cl=8 pF, Total Tol: ±40 ppmXTAL_1612
X232.768kHzCrystal SMD 1610, 32.768 kHz, Cl=9 pF, Total Tol: ±50 ppmXTAL_1610

Circuit configuration no. 2 for CFAA WLCSP

This section contains a configuration summary, a schematic, and bill of materials table for CFAA WLCSP circuit configuration number 2.

Table 13. Configuration summary for circuit configuration no. 2
Config no.Supply configurationEnabled features
VDDHVDDDCDCEN1USB
Config. 2N/ABattery/Ext. regulatorYesYes
Figure 6. Circuit configuration no. 2 schematic for CFAA WLCSP
Note: For PCB reference layouts, see the product page for the nRF52820 on www.nordicsemi.com.
Table 14. Bill of material for circuit configuration no. 2
DesignatorValueDescriptionFootprint
C1, C2, C11, C1212 pFCapacitor, NP0, ±2%0201
C31.0 pFCapacitor, NP0, ±5%0201
C4, C7100 nFCapacitor, X7S, ±10%0201
C5, C144.7 µFCapacitor, X7R, ±10%0603
C6820 pF

Capacitor, X7R, ±10%

Not required for Dxx and later

0201
C8, C91.0 µFCapacitor, X7S, ±10%0402
C1047 nFCapacitor, X7S, ±10%0201
C134.7 µFCapacitor, X7S, ±10%0603
L13.9 nHHigh frequency chip inductor ±5%0201
L24.7 nHHigh frequency chip inductor ±5%0201
L310 µHChip inductor, IDC,min = 50 mA, ±20%0603
L415 nHInductor, 250 mA, ±5%0201
U1nRF52820-CFAAMultiprotocol Bluetooth Low Energy, IEEE 802.15.4, ANT, and 2.4 GHz proprietary System on ChipWLCSP-44
X132 MHzXTAL SMD 1612, 32 MHz, Cl=8 pF, Total Tol: ±40 ppmXTAL_1612
X232.768 kHzXTAL SMD 1610, 32.768 kHz, Cl=9 pF, Total Tol: ±50 ppmXTAL_1610

Circuit configuration no. 3 for CFAA WLCSP

This section contains a configuration summary, a schematic, and bill of materials table for CFAA WLCSP circuit configuration number 3.

Table 15. Configuration summary for circuit configuration no. 3
Config no.Supply configurationEnabled features
VDDHVDDDCDCEN1USB
Config. 3N/ABattery/Ext. regulatorNoYes
Figure 7. Circuit configuration no. 3 schematic for CFAA WLCSP
Note: For PCB reference layouts, see the product page for the nRF52820 on www.nordicsemi.com.
Table 16. Bill of material for circuit configuration no. 3
DesignatorValueDescriptionFootprint
C1, C2, C11, C1212 pFCapacitor, NP0, ±2%0201
C31.0 pFCapacitor, NP0, ±5%0201
C4, C7100 nFCapacitor, X7S, ±10%0201
C5, C144.7 µFCapacitor, X7R, ±10%0603
C6820 pF

Capacitor, X7R, ±10%

Not required for Dxx and later

0201
C8, C91.0 µFCapacitor, X7S, ±10%0402
C134.7 µFCapacitor, X7S, ±10%0603
L13.9 nHHigh frequency chip inductor ±5%0201
L24.7 nHHigh frequency chip inductor ±5%0201
U1nRF52820-CFAAMultiprotocol Bluetooth Low Energy, IEEE 802.15.4, ANT, and 2.4 GHz proprietary System on ChipWLCSP-44
X132 MHzXTAL SMD 1612, 32 MHz, Cl=8 pF, Total Tol: ±40 ppmXTAL_1612
X232.768 kHzXTAL SMD 1610, 32.768 kHz, Cl=9 pF, Total Tol: ±50 ppmXTAL_1610

Circuit configuration no. 4 for CFAA WLCSP

This section contains a configuration summary, a schematic, and bill of materials table for CFAA WLCSP circuit configuration number 4.

Table 17. Configuration summary for circuit configuration no. 4
Config no.Supply configurationEnabled features
VDDHVDDDCDCEN1USB
Config. 4N/ABattery/Ext. regulatorNoNo
Figure 8. Circuit configuration no. 4 schematic for CFAA WLCSP
Note: For PCB reference layouts, see the product page for the nRF52820 on www.nordicsemi.com.
Table 18. Bill of material for circuit configuration no. 4
DesignatorValueDescriptionFootprint
C1, C2, C11, C1212 pFCapacitor, NP0, ±2%0201
C31.0 pFCapacitor, NP0, ±5%0201
C4, C7100 nFCapacitor, X7S, ±10%0201
C54.7 µFCapacitor, X7R, ±10%0603
C6820 pF

Capacitor, X7R, ±10%

Not required for Dxx and later

0201
C8, C91.0 µFCapacitor, X7S, ±10%0402
L13.9 nHHigh frequency chip inductor ±5%0201
L24.7 nHHigh frequency chip inductor ±5%0201
U1nRF52820-CFAAMultiprotocol Bluetooth Low Energy, IEEE 802.15.4, ANT, and 2.4 GHz proprietary System on ChipWLCSP-44
X132 MHzXTAL SMD 1612, 32 MHz, Cl=8 pF, Total Tol: ±40 ppmXTAL_1612
X232.768 kHzXTAL SMD 1610, 32.768 kHz, Cl=9 pF, Total Tol: ±50 ppmXTAL_1610

PCB guidelines

A well designed PCB is necessary to achieve good RF performance. Poor layout can lead to loss in performance or functionality.

A qualified RF layout for the device and its surrounding components, including matching networks, can be downloaded from www.nordicsemi.com.

To ensure optimal performance it is essential that you follow the schematics and layout references closely. Especially in the case of the antenna matching circuitry (components between device pin ANT and the antenna), any changes to the layout can change the behavior, resulting in degradation of RF performance or a need to change component values. All reference circuits are designed for use with a 50 Ω single-ended antenna.

A PCB with a minimum of four layers, including a ground plane, is recommended for optimal performance. On the inner layers, put a keep-out area on the inner layers directly below the antenna matching circuitry (components between device pin ANT and the antenna) to reduce the stray capacitances that influence RF performance.

A matching network is needed between the RF pin ANT and the antenna, to match the antenna impedance (normally 50 Ω) to the optimum RF load impedance for the chip. For optimum performance, the impedance for the matching network should be set as described in the recommended package reference circuitry in Reference circuitry.

The DC supply voltage should be decoupled as close as possible to the VDD pins with high performance RF capacitors. See the schematics for recommended decoupling capacitor values. The supply voltage for the chip should be filtered and routed separately from the supply voltages of any digital circuitry.

Long power supply lines on the PCB should be avoided. All device grounds, VDD connections, and VDD bypass capacitors must be connected as close as possible to the device. For a PCB with a topside RF ground plane, the VSS pins should be connected directly to the ground plane. For a PCB with a bottom ground plane, the best technique is to have via holes as close as possible to the VSS pads. A minimum of one via hole should be used for each VSS pin.

Fast switching digital signals should not be routed close to the crystal or the power supply lines. Capacitive loading of fast switching digital output lines should be minimized in order to avoid radio interference.

PCB layout example

The PCB layout shown in the following figures is a reference layout for the QFN package with internal LDO setup and VBUS supply.

Note: Pay attention to how the capacitor C3 is grounded. It is not directly connected to the ground plane, but grounded via VSS_PA pin 25. This is done to create additional filtering of harmonic components.

For all available reference layouts, see the product page for the nRF52820 on www.nordicsemi.com.

Figure 9. Top silk layer


Figure 10. Top layer


Figure 11. Mid layer 1


Figure 12. Mid layer 2


Figure 13. Bottom layer


Note: No components in bottom layer.

PMIC support

The nRF52 Series is comprehensively supported by Nordic Semiconductor's own range of PMICs (Power Management Integrated Circuits). These PMICs are meticulously designed to enhance the performance and efficiency of the nRF52 Series devices. This integration ensures the longest battery life and the highest reliability for the end application. The synergy between the nRF52 Series and the Nordic PMICs highlights Nordic Semiconductor's commitment to providing a complete and cohesive solution for their customers' needs in wireless technology applications.