Reference circuitry

To ensure good RF performance when designing PCBs, it is highly recommended to use the PCB layouts and component values provided by Nordic Semiconductor.

Documentation for the different package reference circuits, including Altium Designer files, PCB layout files, and PCB production files can be downloaded from the product page for the nRF52840 on www.nordicsemi.com.

In this section there are reference circuits for QIAA aQFN73™, QFAA QFN48, and CKAA WLCSP showing the components and component values to support on-chip features in a design.

Note: This is not a complete list of configurations, but all required circuitry is shown for further configurations.
Some general guidance is summarized here:
  • External supply from VDD is only available when power is supplied to VDDH. External supply is annotated with the VEXT net name.
  • When supplying power from a USB source only, VBUS must be connected to VDDH if USB is to be used.
  • Components required for DC/DC function are only needed if DC/DC mode is enabled for that regulator.
  • NFC can be used in any configuration.
  • USB can be used in any configuration as long as VBUS is supplied by the USB host.
  • The schematics include an optional series resistor on the USB supply for improved immunity to transient overvoltage during VBUS connection. Using the series resistor is recommended for new designs.
  • Two component values for the RF-Match network for the QIAA aQFN73 package are given and referred to as v1.0 and v1.1 in the following tables. The reference schematics use v1.1 component values, which are recommended for new designs to improve the margin for spurious emissions during regulatory approval tests. However, both v1.0 and v1.1 are valid and can be used. All other RF parameters are unchanged.
  • A new reference design with four-component RF match has been added for the QIAA aQFN™73 package. The four-component RF match improves harmonic suppression when using Radio with TXPOWER equal to 5dBm or above. However, previous 3 component RF-match designs are valid and can be used. Using this four-component RF match is recommended for new designs.

Circuit configurations for QIAA aQFN73

Table 1. Circuit configurations
Config no.Supply configurationFeatures that can be enabled for each configuration example
VDDHVDDEXTSUPPLYDCDCEN0DCDCEN1USBNFC
Config. 1USB (VDDH = VBUS)N/AYesNoNoYesNo
Config. 2Battery/Ext. regulatorN/AYesNoNoYesNo
Config. 3N/ABattery/Ext. regulatorNoNoNoYesNo
Config. 4Battery/Ext. regulatorN/AYesYesYesYesNo
Config. 5N/ABattery/Ext. regulatorNoNoYesYesYes
Config. 6N/ABattery/Ext. regulatorNoNoNoNoNo
Config. 71Battery/Ext. regulatorN/AYesYesYesYesNo

1Reference design with four-component RF match.

Circuit configurations for QFAA QFN48

Table 2. Circuit configurations
Config no.Supply configurationFeatures that can be enabled for each configuration example
VDDH1VDDEXTSUPPLY2DCDCEN03DCDCEN1USB4NFC
Config. 1N/ABattery/Ext. regulatorN/AN/AYesN/ANo

1High Voltage supply mode cannot be used because the VDDH pin is not routed in the QFN48 package.

2The external supply feature cannot be used because the VDDH pin is not routed in the QFN48 package.

3DCDC for REG0 stage cannot be used because the VDDH pin is not routed in the QFN48 package.

4USBD cannot be used because the USB pins are not routed in the QFN48 package.

Circuit configurations for CKAA WLCSP

Table 3. Circuit configurations
Config no.Supply configurationFeatures that can be enabled for each configuration example
VDDHVDDEXTSUPPLYDCDCEN0DCDCEN1USBNFC
Config. 1USB (VDDH = VBUS)N/AYesNoNoYesNo
Config. 2Battery/Ext. regulatorN/AYesNoNoYesNo
Config. 3N/ABattery/Ext. regulatorNoNoNoYesNo
Config. 4Battery/Ext. regulatorN/AYesYesYesYesNo
Config. 5N/ABattery/Ext. regulatorNoNoYesYesYes
Config. 6N/ABattery/Ext. regulatorNoNoNoNoNo

Circuit configuration no. 1 for QIAA aQFN73

Circuit configuration number 1 for QIAA aQFN73, showing the schematic and the bill of materials.

Table 4. Configuration summary for circuit configuration no. 1
Config no.Supply configurationEnabled features
VDDHVDDEXTSUPPLYDCDCEN0DCDCEN1USBNFC
Config. 1USB (VDDH = VBUS)N/AYesNoNoYesNo
Figure 1. Circuit configuration no. 1 schematic


Note: For PCB reference layouts, see the product page for the nRF52840 on www.nordicsemi.com.
Table 5. Bill of material for circuit configuration no. 1
DesignatorValue v1.0Value v1.1DescriptionFootprint
C1, C2, C17, C1812 pFCapacitor, NP0, ±2%0402
C31 pF0.8 pFCapacitor, NP0, ±10%0402
C41 pF0.5 pFCapacitor, NP0, ±10%0402
C5, C7, C8, C12100 nFCapacitor, X7R, ±10%0402
C6, C204.7 µFCapacitor, X7R, ±10%0603
C9820 pF

Capacitor, NP0, ±5%

Not required for Fxx and later

0402
C10, C13, C22N.C.Not mounted0402
C11100 pFCapacitor, NP0, ±5%0402
C14, C151.0 µFCapacitor, X7R, ±10%0603
C194.7 µFCapacitor, X7S, ±10%0603
L13.9 nH4.7 nHHigh frequency chip inductor ±5%0402
R12R2Resistor ±1%, 0.063W0402
U1nRF52840-QIAAMultiprotocol Bluetooth® low energy, IEEE 802.15.4, ANT, and 2.4 GHz proprietary System on ChipAQFN-73
X132 MHzXTAL SMD 2016, 32 MHz, Cl=8 pF, Total Tol: ±40 ppmXTAL_2016
X232.768 kHzXTAL SMD 3215, 32.768 kHz, Cl=9 pF, Total Tol: ±50 ppmXTAL_3215

Circuit configuration no. 2 for QIAA aQFN73

Circuit configuration number 2 for QIAA aQFN73, showing the schematic and the bill of materials.

Table 6. Configuration summary for circuit configuration no. 2
Config no.Supply configurationEnabled features
VDDHVDDEXTSUPPLYDCDCEN0DCDCEN1USBNFC
Config. 2Battery/Ext. regulatorN/AYesNoNoYesNo
Figure 2. Circuit configuration no. 2 schematic


Note: For PCB reference layouts, see the product page for the nRF52840 on www.nordicsemi.com.
Table 7. Bill of material for circuit configuration no. 2
DesignatorValue v1.0Value v1.1DescriptionFootprint
C1, C2, C17, C1812 pFCapacitor, NP0, ±2%0402
C31 pF0.8 pFCapacitor, NP0, ±10%0402
C41 pF0.5 pFCapacitor, NP0, ±10%0402
C5, C7, C8, C12100 nFCapacitor, X7R, ±10%0402
C6, C204.7 µFCapacitor, X7R, ±10%0603
C9820 pF

Capacitor, NP0, ±5%

Not required for Fxx and later

0402
C10, C13, C22N.C.Not mounted0402
C11100 pFCapacitor, NP0, ±5%0402
C14, C151.0 µFCapacitor, X7R, ±10%0603
C19, C214.7 µFCapacitor, X7S, ±10%0603
L13.9 nH4.7 nHHigh frequency chip inductor ±5%0402
U1nRF52840-QIAAMultiprotocol Bluetooth low energy, IEEE 802.15.4, ANT, and 2.4 GHz proprietary System on ChipAQFN-73
X132 MHzXTAL SMD 2016, 32 MHz, Cl=8 pF, Total Tol: ±40 ppmXTAL_2016
X232.768 kHzXTAL SMD 3215, 32.768 kHz, Cl=9 pF, Total Tol: ±50 ppmXTAL_3215

Circuit configuration no. 3 for QIAA aQFN73

Circuit configuration number 3 for QIAA aQFN73, showing the schematic and the bill of materials.

Table 8. Configuration summary for circuit configuration no. 3
Config no.Supply configurationEnabled features
VDDHVDDEXTSUPPLYDCDCEN0DCDCEN1USBNFC
Config. 3N/ABattery/Ext. regulatorNoNoNoYesNo
Figure 3. Circuit configuration no. 3 schematic


Note: For PCB reference layouts, see the product page for the nRF52840 on www.nordicsemi.com.
Table 9. Bill of material for circuit configuration no. 3
DesignatorValue v1.0Value v1.1DescriptionFootprint
C1, C2, C17, C1812 pFCapacitor, NP0, ±2%0402
C31 pF0.8 pFCapacitor, NP0, ±10%0402
C41 pF0.5 pFCapacitor, NP0, ±10%0402
C5, C7, C8, C12100 nFCapacitor, X7R, ±10%0402
C6, C204.7 µFCapacitor, X7R, ±10%0603
C9820 pF

Capacitor, NP0, ±5%

Not required for Fxx and later

0402
C10, C13, C22N.C.Not mounted0402
C11100 pFCapacitor, NP0, ±5%0402
C14, C151.0 µFCapacitor, X7R, ±10%0603
C214.7 µFCapacitor, X7S, ±10%0603
L13.9 nH4.7 nHHigh frequency chip inductor ±5%0402
U1nRF52840-QIAAMultiprotocol Bluetooth low energy, IEEE 802.15.4, ANT, and 2.4 GHz proprietary System on ChipAQFN-73
X132 MHzXTAL SMD 2016, 32 MHz, Cl=8 pF, Total Tol: ±40 ppmXTAL_2016
X232.768 kHzXTAL SMD 3215, 32.768 kHz, Cl=9 pF, Total Tol: ±50 ppmXTAL_3215

Circuit configuration no. 4 for QIAA aQFN73

Circuit configuration number 4 for QIAA aQFN73, showing the schematic and the bill of materials.

Table 10. Configuration summary for circuit configuration no. 4
Config no.Supply configurationEnabled features
VDDHVDDEXTSUPPLYDCDCEN0DCDCEN1USBNFC
Config. 4Battery/Ext. regulatorN/AYesYesYesYesNo
Figure 4. Circuit configuration no. 4 schematic for QIAA aQFN73


Note: For PCB reference layouts, see the product page for the nRF52840 on www.nordicsemi.com.
Table 11. Bill of material for circuit configuration no. 4
DesignatorValue v1.0Value v1.1DescriptionFootprint
C1, C2, C17, C1812 pFCapacitor, NP0, ±2%0402
C31 pF0.8 pFCapacitor, NP0, ±10%0402
C41 pF0.5 pFCapacitor, NP0, ±10%0402
C5, C7, C8, C12100 nFCapacitor, X7R, ±10%0402
C6, C204.7 µFCapacitor, X7R, ±10%0603
C9820 pF

Capacitor, NP0, ±5%

Not required for Fxx and later

0402
C10, C13, C22N.C.Not mounted0402
C11100 pFCapacitor, NP0, ±5%0402
C14, C151.0 µFCapacitor, X7R, ±10%0603
C1647 nFCapacitor, X7R, ±10%0402
C19, C214.7 µFCapacitor, X7S, ±10%0603
L13.9 nH4.7 nHHigh frequency chip inductor ±5%0402
L210 µHChip inductor, IDC, min = 50 mA, ±20%0603
L315 nHHigh frequency chip inductor ±10%0402
L410 µHChip inductor, IDC, min = 80 mA, ±20%0603
U1nRF52840-QIAAMultiprotocol Bluetooth low energy, IEEE 802.15.4, ANT, and 2.4 GHz proprietary System on ChipAQFN-73
X132 MHzXTAL SMD 2016, 32 MHz, Cl=8 pF, Total Tol: ±40 ppmXTAL_2016
X232.768 kHzXTAL SMD 3215, 32.768 kHz, Cl=9 pF, Total Tol: ±50 ppmXTAL_3215

Circuit configuration no. 5 for QIAA aQFN73

Circuit configuration number 5 for QIAA aQFN73, showing the schematic and the bill of materials.

Table 12. Configuration summary for circuit configuration no. 5
Config no.Supply configurationEnabled features
VDDHVDDEXTSUPPLYDCDCEN0DCDCEN1USBNFC
Config. 5N/ABattery/Ext. regulatorNoNoYesYesYes
Figure 5. Circuit configuration no. 5 schematic


Note: For PCB reference layouts, see the product page for the nRF52840 on www.nordicsemi.com.
Table 13. Bill of material for circuit configuration no. 5
DesignatorValue v1.0Value v1.1DescriptionFootprint
C1, C2, C17, C1812 pFCapacitor, NP0, ±2%0402
C31 pF0.8 pFCapacitor, NP0, ±10%0402
C41 pF0.5 pFCapacitor, NP0, ±10%0402
C5, C7, C8, C12100 nFCapacitor, X7R, ±10%0402
C6, C204.7 µFCapacitor, X7R, ±10%0603
C9820 pFCapacitor, NP0, ±5%0402
C10, C13, C22N.C.Not mounted0402
C11100 pFCapacitor, NP0, ±5%0402
C14, C151.0 µFCapacitor, X7R, ±10%0603
C1647 nFCapacitor, X7R, ±10%0402
C214.7 µFCapacitor, X7S, ±10%0603
CT1, CT2, CT3, CT4Antenna dependentCapacitor, NP0, ±5%0402
L13.9 nH4.7 nHHigh frequency chip inductor ±5%0402
L210 µHChip inductor, IDC, min = 50 mA, ±20%0603
L315 nHHigh frequency chip inductor ±10%0402
U1nRF52840-QIAAMultiprotocol Bluetooth low energy, IEEE 802.15.4, ANT, and 2.4 GHz proprietary System on ChipAQFN-73
X132 MHzXTAL SMD 2016, 32 MHz, Cl=8 pF, Total Tol: ±40 ppmXTAL_2016
X232.768 kHzXTAL 3215, 32.768 kHz, Cl=9 pF, Total Tol: ±50 ppmXTAL_3215

Circuit configuration no. 6 for QIAA aQFN73

Circuit configuration number 6 for QIAA aQFN73, showing the schematic and the bill of materials.

Table 14. Configuration summary for circuit configuration no. 6
Config no.Supply configurationEnabled features
VDDHVDDEXTSUPPLYDCDCEN0DCDCEN1USBNFC
Config. 6N/ABattery/Ext. regulatorNoNoNoNoNo
Figure 6. Circuit configuration no. 6 schematic


Note: For PCB reference layouts, see the product page for the nRF52840 on www.nordicsemi.com.
Table 15. Bill of material for circuit configuration no. 6
DesignatorValue v1.0Value v1.1DescriptionFootprint
C1, C2, C17, C1812 pFCapacitor, NP0, ±2%0402
C31 pF0.8 pFCapacitor, NP0, ±10%0402
C41 pF0.5 pFCapacitor, NP0, ±10%0402
C5, C7, C8, C12100 nFCapacitor, X7R, ±10%0402
C64.7 µFCapacitor, X7R, ±10%0603
C9820 pF

Capacitor, NP0, ±5%

Not required for Fxx and later

0402
C10, C13, C22N.C.Not mounted0402
C11100 pFCapacitor, NP0, ±5%0402
C14, C151.0 µFCapacitor, X7R, ±10%0603
L13.9 nH4.7 nHHigh frequency chip inductor ±5%0402
U1nRF52840-QIAAMultiprotocol Bluetooth low energy, IEEE 802.15.4, ANT, and 2.4 GHz proprietary System on ChipAQFN-73
X132 MHzXTAL SMD 2016, 32 MHz, Cl=8 pF, Total Tol: ±40 ppmXTAL_2016
X232.768 kHzXTAL SMD 3215, 32.768 kHz, Cl=9 pF, Total Tol: ±50 ppmXTAL_3215

Circuit configuration no. 7 for QIAA aQFN73

Circuit configuration number 7 for QIAAaQFN73, showing the schematic and the bill of materials.

This circuit configuration includes a four-component RF match for improved harmonic suppression when using RADIO with TXPOWER ≥ 5 dBm.

Table 16. Configuration summary for circuit configuration no. 7
Config no.Supply configurationEnabled features
VDDHVDDEXTSUPPLYDCDCEN0DCDCEN1USBNFC
Config. 7Battery/Ext. regulatorN/AYesYesYesYesNo
Figure 7. Circuit configuration no. 7 schematic for QIAA aQFN73


Note: For PCB reference layouts, see the product page for the nRF52840 on www.nordicsemi.com.
Table 17. Bill of material for circuit configuration no. 7
DesignatorValueDescriptionFootprint
C1, C2, C17, C1812 pFCapacitor, NP0, ±2%0402
C31 pFCapacitor, NP0, ±5%0402
C41.2 pFCapacitor, NP0, ±5%0402
C5, C7, C8, C12100 nFCapacitor, X7R, ±10%0402
C6, C204.7 µFCapacitor, X7R, ±10%0603
C9820 pF

Capacitor, NP0, ±5%

Not required for Fxx and later

0402
C10, C13N.C.Not mounted0402
C11100 pFCapacitor, NP0, ±5%0402
C14, C151.0 µFCapacitor, X7R, ±10%0603
C1647 nFCapacitor, X7R, ±10%0402
C19, C214.7 µFCapacitor, X7S, ±10%0603
L14.7 nHHigh frequency chip inductor ±5%0402
L210 µHChip inductor, IDC, min = 50 mA, ±20%0603
L315 nHHigh frequency chip inductor ±10%0402
L410 µHChip inductor, IDC, min = 80 mA, ±20%0603
L52.2 nHHigh frequency chip inductor ±5%0402
U1nRF52840-QIAAMultiprotocol Bluetooth low energy, IEEE 802.15.4, ANT, and 2.4 GHz proprietary System on ChipAQFN-73
X132 MHzXTAL SMD 2016, 32 MHz, Cl=8 pF, Total Tol: ±40 ppmXTAL_2016
X232.768 kHzXTAL SMD 3215, 32.768 kHz, Cl=9 pF, Total Tol: ±50 ppmXTAL_3215

Circuit configuration no. 1 for QFAA QFN48

Circuit configuration number 1 for QFAA QFN48, showing the schematic and the bill of materials.

Table 18. Configuration summary for circuit configuration no. 1
Config no.Supply configurationEnabled features
VDDHVDDEXTSUPPLYDCDCEN0DCDCEN1USBNFC
Config. 1N/ABattery/Ext. regulatorN/AN/AYesN/ANo
Figure 8. Circuit configuration no. 1 schematic


Note: For PCB reference layouts, see the product page for the nRF52840 on www.nordicsemi.com.
Table 19. Bill of material for circuit configuration no. 1
DesignatorValueDescriptionFootprint
C1, C2, C16, C1712 pFCapacitor, NP0, ±2%0201
C31.0 pFCapacitor, NP0, ±10%0201
C41.2 pFCapacitor, NP0, ±10%0201
C5, C6, C7, C8, C12100 nFCapacitor, X5R, ±10%0201
C10N.C.Not mounted0201
C11100 pFCapacitor, NP0, ±5%0201
C13, C141.0 µFCapacitor, X5R, ±10%0402
C1547 nFCapacitor, X5R, ±10%0201
L14.7 nHHigh frequency chip inductor ±5%0201
L22.2 nHHigh frequency chip inductor ±5%0201
L310 µHChip inductor, IDC, min = 50 mA, ±20%0603
L415 nHHigh frequency chip inductor ±10%0402
U1nRF52840-QFAAMultiprotocol Bluetooth low energy, IEEE 802.15.4, ANT, and 2.4 GHz proprietary System on ChipQFN48
X132 MHzXTAL SMD 2016, 32 MHz, Cl=8 pF, Total Tol: ±30 ppmXTAL_2016
X232.768 kHzXTAL SMD 2012, 32.768 kHz, Cl=9 pF, Total Tol: ±50 ppmXTAL_2012

Circuit configuration no. 1 for CKAA WLCSP

Circuit configuration number 1 for CKAA WLCSP, showing the schematic and the bill of materials.

Table 20. Configuration summary for circuit configuration no. 1
Config no.Supply configurationEnabled features
VDDHVDDEXTSUPPLYDCDCEN0DCDCEN1USBNFC
Config. 1USB (VDDH = VBUS)N/AYesNoNoYesNo
Figure 9. Circuit configuration no. 1 schematic for CKAA WLCSP
Note: For PCB reference layouts, see the product page for the nRF52840 on www.nordicsemi.com.
Table 21. Bill of material for circuit configuration no. 1
DesignatorValueDescriptionFootprint
C1, C2, C17, C1812 pFCapacitor, NP0, ±2%0201
C31.0 pFCapacitor, NP0, ±5%0201
C5, C7, C8, C12100 nFCapacitor, X7R, ±10%0201
C6, C204.7 µFCapacitor, X7R, ±10%0603
C9820 pF

Capacitor, X7R, ±10%

Not required for Fxx and later

0201
C14, C151.0 µFCapacitor, X7R, ±10%0603
C194.7 µFCapacitor, X7S, ±10%0603
L13.9 nHHigh frequency chip inductor ±5%0201
L54.7 nHHigh frequency chip inductor ±5%0201
R12R2Resistor, ±1%, 0.05W0201
U1nRF52840-CKAAMultiprotocol Bluetooth low energy, IEEE 802.15.4, ANT, and 2.4 GHz proprietary System on ChipWLCSP-94
X132 MHzXTAL SMD 2016, 32 MHz, Cl=8 pF, Total Tol: ±40 ppmXTAL_2016
X232.768 kHzXTAL SMD 2012, 32.768 kHz, Cl=9 pF, Total Tol: ±50 ppmXTAL_2012

Circuit configuration no. 2 for CKAA WLCSP

Circuit configuration number 2 for CKAA WLCSP, showing the schematic and the bill of materials.

Table 22. Configuration summary for circuit configuration no. 2
Config no.Supply configurationEnabled features
VDDHVDDEXTSUPPLYDCDCEN0DCDCEN1USBNFC
Config. 2Battery/Ext. regulatorN/AYesNoNoYesNo
Figure 10. Circuit configuration no. 2 schematic for CKAA WLCSP
Note: For PCB reference layouts, see the product page for the nRF52840 on www.nordicsemi.com.
Table 23. Bill of material for circuit configuration no. 2
DesignatorValueDescriptionFootprint
C1, C2, C17, C1812 pFCapacitor, NP0, ±2%0201
C31.0 pFCapacitor, NP0, ±5%0201
C5, C7, C8, C12100 nFCapacitor, X7R, ±10%0201
C6, C204.7 µFCapacitor, X7R, ±10%0603
C9820 pF

Capacitor, X7R, ±10%

Not required for Fxx and later

0201
C14, C151.0 µFCapacitor, X7R, ±10%0603
C19, C214.7 µFCapacitor, X7S, ±10%0603
L13.9 nHHigh frequency chip inductor ±5%0201
L54.7 nHHigh frequency chip inductor ±5%0201
U1nRF52840-CKAAMultiprotocol Bluetooth low energy, IEEE 802.15.4, ANT, and 2.4 GHz proprietary System on ChipWLCSP-94
X132 MHzXTAL SMD 2016, 32 MHz, Cl=8 pF, Total Tol: ±40 ppmXTAL_2016
X232.768 kHzXTAL SMD 2012, 32.768 kHz, Cl=9 pF, Total Tol: ±50 ppmXTAL_2012

Circuit configuration no. 3 for CKAA WLCSP

Circuit configuration number 3 for CKAA WLCSP, showing the schematic and the bill of materials.

Table 24. Configuration summary for circuit configuration no. 3
Config no.Supply configurationEnabled features
VDDHVDDEXTSUPPLYDCDCEN0DCDCEN1USBNFC
Config. 3N/ABattery/Ext. regulatorNoNoNoYesNo
Figure 11. Circuit configuration no. 3 schematic for CKAA WLCSP
Note: For PCB reference layouts, see the product page for the nRF52840 on www.nordicsemi.com.
Table 25. Bill of material for circuit configuration no. 3
DesignatorValueDescriptionFootprint
C1, C2, C17, C1812 pFCapacitor, NP0, ±2%0201
C31.0 pFCapacitor, NP0, ±5%0201
C5, C7, C8, C12100 nFCapacitor, X7R, ±10%0201
C6, C204.7 µFCapacitor, X7R, ±10%0603
C9820 pF

Capacitor, X7R, ±10%

Not required for Fxx and later

0201
C14, C151.0 µFCapacitor, X7R, ±10%0603
C214.7 µFCapacitor, X7S, ±10%0603
L13.9 nHHigh frequency chip inductor ±5%0201
L54.7 nHHigh frequency chip inductor ±5%0201
U1nRF52840-CKAAMultiprotocol Bluetooth low energy, IEEE 802.15.4, ANT, and 2.4 GHz proprietary System on ChipWLCSP-94
X132 MHzXTAL SMD 2016, 32 MHz, Cl=8 pF, Total Tol: ±40 ppmXTAL_2016
X232.768 kHzXTAL SMD 2012, 32.768 kHz, Cl=9 pF, Total Tol: ±50 ppmXTAL_2012

Circuit configuration no. 4 for CKAA WLCSP

Circuit configuration number 4 for CKAA WLCSP, showing the schematic and the bill of materials.

Table 26. Configuration summary for circuit configuration no. 4
Config no.Supply configurationEnabled features
VDDHVDDEXTSUPPLYDCDCEN0DCDCEN1USBNFC
Config. 4Battery/Ext. regulatorN/AYesYesYesYesNo
Figure 12. Circuit configuration no. 4 schematic for CKAA WLCSP
Note: For PCB reference layouts, see the product page for the nRF52840 on www.nordicsemi.com.
Table 27. Bill of material for circuit configuration no. 4
DesignatorValueDescriptionFootprint
C1, C2, C17, C1812 pFCapacitor, NP0, ±2%0201
C31.0 pFCapacitor, NP0, ±5%0201
C5, C7, C8, C12100 nFCapacitor, X7R, ±10%0201
C6, C204.7 µFCapacitor, X7R, ±10%0603
C9820 pF

Capacitor, X7R, ±10%

Not required for Fxx and later

0201
C14, C151.0 µFCapacitor, X7R, ±10%0603
C1647 nFCapacitor, X7R, ±10%0201
C19, C214.7 µFCapacitor, X7S, ±10%0603
L13.9 nHHigh frequency chip inductor ±5%0201
L210 µHChip inductor, IDC, min = 50 mA, ±20%0603
L315 nHHigh frequency chip inductor ±10%0402
L410 µHChip inductor, IDC, min = 80 mA, ±10%0603
L54.7 nHHigh frequency chip inductor ±5%0201
U1nRF52840-CKAAMultiprotocol Bluetooth low energy, IEEE 802.15.4, ANT, and 2.4 GHz proprietary System on ChipWLCSP-94
X132 MHzXTAL SMD 2016, 32 MHz, Cl=8 pF, Total Tol: ±40 ppmXTAL_2016
X232.768 kHzXTAL SMD 2012, 32.768 kHz, Cl=9 pF, Total Tol: ±50 ppmXTAL_2012

Circuit configuration no. 5 for CKAA WLCSP

Circuit configuration number 5 for CKAA WLCSP, showing the schematic and the bill of materials.

Table 28. Configuration summary for circuit configuration no. 5
Config no.Supply configurationEnabled features
VDDHVDDEXTSUPPLYDCDCEN0DCDCEN1USBNFC
Config. 5N/ABattery/Ext. regulatorNoNoYesYesYes
Figure 13. Circuit configuration no. 5 schematic for CKAA WLCSP
Note: For PCB reference layouts, see the product page for the nRF52840 on www.nordicsemi.com.
Table 29. Bill of material for circuit configuration no. 5
DesignatorValueDescriptionFootprint
C1, C2, C17, C1812 pFCapacitor, NP0, ±2%0201
C31.0 pFCapacitor, NP0, ±5%0201
C5, C7, C8, C12100 nFCapacitor, X7R, ±10%0201
C6, C204.7 µFCapacitor, X7R, ±10%0603
C9820 pF

Capacitor, X7R, ±10%

Not required for Fxx and later

0201
C14, C151.0 µFCapacitor, X7R, ±10%0603
C1647 nFCapacitor, X7R, ± 10%0201
C214.7 µFCapacitor, X7S, ± 10%0603
CT1, CT2, CT3, CT4Antenna dependentCapacitor, X7R, ± 10%0201
L13.9 nHHigh frequency chip inductor ±5%0201
L210 µHChip inductor, IDC, min = 50 mA, ±20%0603
L315 nHHigh frequency chip inductor ±10%0402
L54.7 nHHigh frequency chip inductor ±5%0201
U1nRF52840-CKAAMultiprotocol Bluetooth low energy, IEEE 802.15.4, ANT, and 2.4 GHz proprietary System on ChipWLCSP-94
X132 MHzXTAL SMD 2016, 32 MHz, Cl=8 pF, Total Tol: ±40 ppmXTAL_2016
X232.768 kHzXTAL SMD 2012, 32.768 kHz, Cl=9 pF, Total Tol: ±50 ppmXTAL_2012

Circuit configuration no. 6 for CKAA WLCSP

Circuit configuration number 6 for CKAA WLCSP, showing the schematic and the bill of materials.

Table 30. Configuration summary for circuit configuration no. 6
Config no.Supply configurationEnabled features
VDDHVDDEXTSUPPLYDCDCEN0DCDCEN1USBNFC
Config. 6N/ABattery/Ext. regulatorNoNoNoNoNo
Figure 14. Circuit configuration no. 6 schematic for CKAA WLCSP
Note: For PCB reference layouts, see the product page for the nRF52840 on www.nordicsemi.com.
Table 31. Bill of material for circuit configuration no. 6
DesignatorValueDescriptionFootprint
C1, C2, C17, C1812 pFCapacitor, NP0, ±2%0201
C31.0 pFCapacitor, NP0, ±5%0201
C5, C7, C8, C12100 nFCapacitor, X7R, ±10%0201
C64.7 µFCapacitor, X7R, ±10%0603
C9820 pF

Capacitor, X7R, ±10%

Not required for Fxx and later

0201
C14, C151.0 µFCapacitor, X7R, ±10%0603
L13.9 nHHigh frequency chip inductor ±5%0201
L54.7 nHHigh frequency chip inductor ±5%0201
U1nRF52840-CKAAMultiprotocol Bluetooth low energy, IEEE 802.15.4, ANT, and 2.4 GHz proprietary System on ChipWLCSP-94
X132 MHzXTAL SMD 2016, 32 MHz, Cl=8 pF, Total Tol: ±40 ppmXTAL_2016
X232.768 kHzXTAL SMD 2012, 32.768 kHz, Cl=9 pF, Total Tol: ±50 ppmXTAL_2012

PCB guidelines

A well designed PCB is necessary to achieve good RF performance. Poor layout can lead to loss in performance or functionality.

A qualified RF layout for the IC and its surrounding components, including matching networks, can be downloaded from www.nordicsemi.com.

To ensure optimal performance it is essential that you follow the schematics and layout references closely. Especially in the case of the antenna matching circuitry (components between device pin ANT and the antenna), any changes to the layout can change the behavior, resulting in degradation of RF performance or a need to change component values. All reference circuits are designed for use with a 50 Ω single-ended antenna.

A PCB with a minimum of two layers, including a ground plane, is recommended for optimal RF performance. On PCBs with more than two layers, put a keep-out area on the inner layers directly below the antenna matching circuitry (components between device pin ANT and the antenna) to reduce the stray capacitances that influence RF performance.

A matching network is needed between the RF pin ANT and the antenna, to match the antenna impedance (normally 50 Ω) to the optimum RF load impedance for the chip. For optimum performance, the impedance for the matching network should be set as described in the recommended aQFN™73 package reference circuitry from Circuit configuration no. 1 for QIAA aQFN73, the recommended QFN48 reference circuitry from Circuit configuration no. 1 for QFAA QFN48, or the recommended WLCSP reference circuitry from Circuit configuration no. 1 for CKAA WLCSP depending on the package variant used in your design.

The DC supply voltage should be decoupled as close as possible to the VDD pins with high performance RF capacitors. See the schematics for recommended decoupling capacitor values. The supply voltage for the chip should be filtered and routed separately from the supply voltages of any digital circuitry.

Long power supply lines on the PCB should be avoided. All device grounds, VDD connections, and VDD bypass capacitors must be connected as close as possible to the IC. For a PCB with a topside RF ground plane, the VSS pins should be connected directly to the ground plane. For a PCB with a bottom ground plane, the best technique is to have via holes as close as possible to the VSS pads. A minimum of one via hole should be used for each VSS pin.

Fast switching digital signals should not be routed close to the crystal or the power supply lines. Capacitive loading of fast switching digital output lines should be minimized in order to avoid radio interference. Avoid routing the 32MHz crystal lines close to antenna line and antenna ground.

PCB layout example

The PCB layout shown in the following figures is a reference layout for the aQFN™ package with internal LDO setup and VBUS supply.

Note: Pay attention to how the capacitor C3 is grounded. It is not directly connected to the ground plane, but grounded via VSS_PA pin F23. This is done to create additional filtering of harmonic components.

For all available reference layouts, see the product page for the nRF52840 on www.nordicsemi.com.

Figure 15. Top silk layer


Figure 16. Top layer


Figure 17. Mid layer 1


Figure 18. Mid layer 2


Figure 19. Bottom layer


Note: No components in bottom layer.

PMIC support

The nRF52 Series is comprehensively supported by Nordic Semiconductor's own range of PMICs (Power Management Integrated Circuits). These PMICs are meticulously designed to enhance the performance and efficiency of the nRF52 Series devices. This integration ensures the longest battery life and the highest reliability for the end application. The synergy between the nRF52 Series and the Nordic PMICs highlights Nordic Semiconductor's commitment to providing a complete and cohesive solution for their customers' needs in wireless technology applications.