Package thermal characteristics

A summary of the thermal characteristics for the different packages available for the IC can be found below.

Table 1. Package thermal characteristics
SymbolPackageTyp.Unit
θJA,aQFN73aQFN7324.11°C/W
θJA,QFN48QFN4822.37°C/W
θJA,WLCSPWLCSP36.55°C/W

Values obtained by simulation following the EIA/JESD51-2 for still air condition using JEDEC PCB.