Package thermal characteristics

A summary of the thermal characteristics for the different packages available for the IC can be found below.

Table 1. Package thermal characteristics
Symbol	Package	Typ.	Unit
θ_JA,aQFN94	aQFN94	20.74	°C/W
θ_JB,aQFN94	aQFN94	8.10	°C/W
θ_JC,aQFN94	aQFN94	8.75	°C/W
θ_JA,WLCSP	WLCSP	28.51	°C/W
θ_JB,WLCSP	WLCSP	8.73	°C/W
θ_JC,WLCSP	WLCSP	4.04	°C/W

Values obtained by simulation following the EIA/JESD51-2 for still air condition using JEDEC PCB.