CSP47 (CAAA) package
| A | A1 | A2 | A3 | A5 | D | E | D2 | E2 | e | b | F | G | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Min. | 0.377 | 0.08 | 0.275 | 0.022 | 0.14 | ||||||||
| Nom. | 0.420 | 0.300 | 0.03 | 0.025 | 2.451 | 2.245 | 1.8 | 1.8 | 0.3 | 0.913 | 0.828 | ||
| Max. | 0.463 | 0.11 | 0.325 | 0.028 | 0.2 |
The CSP package uses WLCSP (Wafer Level Chip Scale Package) package technology.