Reference circuitry

To ensure good RF performance when designing PCBs, it is highly recommended to use the PCB layouts and component values provided by Nordic Semiconductor.

Documentation for the package reference circuits, including Altium Designer files, PCB layout files, and PCB production files can be downloaded from www.nordicsemi.com.

In this section, there are reference circuits for all product variants, showing the components and component values to support on-chip features in a design.

Circuit configuration 1 for QFN48 (QFAA)

Table 1. Circuit configurations

Config no.	Supply configuration		Enabled features
	VDD		NFC
Config 1	DCDC: supplied by battery or external supply		No

Note: For PCB reference layouts, see the product page for the device on www.nordicsemi.com.

Table 2. Bill of material for circuit configuration 1

Designator	Value	Description	Footprint
C1, C2	2.2 µF	Capacitor, X6T, ±20%, 2.5 V	0201
C3	10 µF	Capacitor, X6S, ±20%, 6.3 V	0402
C4, C7, C8, C10	100 nF	Capacitor, X7R, ±10%	0201
C5	2.2 nF	Capacitor, X7R, ±10%, 10V	0201
C6	1.5 pF	Capacitor, NP0, ±0.05 pF, 25 V, High Q	0201
C9	2.0 pF	Capacitor, NP0, ±0.05 pF, 25 V	0201
C11	0.3 pF	Capacitor, C0G, ±0.1 pF, 50 V	0201
C12	10 nF	Capacitor, X7R, 6.3 V	0201
C13	3.9 pF	Capacitor, C0G, ±0.25 pF, 50 V	0201
FB1	120 Ω	Ferrite bead, 120 Ω at 100 MHz, 200 mA, 500 mΩ Max	0201
L1	4.7 µH	Inductor, 120 mA, ±20%, 650 mΩ	0603
L2	2.7 nH	Inductor, 600 mA, ±0.1 nH, 120 mΩ	0201
L3, L4	3.5 nH	Inductor, 500 mA, ±0.1 nH, 170 mΩ	0201
R1	1 kΩ	Resistor, ±1%, 0.05 W	0201
U1	nRF54L15-QFAA	Multiprotocol Bluetooth® Low Energy, IEEE 802.15.4, and 2.4GHz proprietary System on Chip	QFN-48
X1	32.768 kHz	Crystal SMD 2012, 32.768 kHz, Cl = 9 pF, Total tol: ±20 ppm	XTAL_2012
X2	32 MHz	Crystal SMD 2016, 32 MHz, Cl = 8 pF, Total Tol: ±40 ppm. For frequency tolerance requirements, see 32 MHz crystal oscillator (HFXO).	XTAL_2016

Note: The antenna filtering components are subject to change.

Circuit configuration 1 for CSP47 (CAAA)

Table 3. Circuit configurations

Config no.	Supply configuration		Enabled features
	VDD		NFC
Config 1	DCDC: supplied by battery or external supply		No

Note: For PCB reference layouts, see the product page for the device on www.nordicsemi.com.

Table 4. Bill of material for circuit configuration 1

Designator	Value	Description	Footprint
C1, C2, C13	2.2 µF	Capacitor, X6T, ±20%, 2.5 V	0201
C5	N.C.	Not mounted	0201
C6, C9	1.2 pF	Capacitor, NP0, ±0.05 pF, 50 V	0201
C8, C11	100 nF	Capacitor, X7R, ±10%	0201
C10	10 µF	Capacitor, X6S, ±20%, 6.3 V	0402
C12	N.C.	Not mounted	0201
FB1, FB2	120 Ω	Ferrite bead, 120 Ω at 100 MHz, 200 mA, 500 mΩ Max	0201
L1	4.7 µH	Inductor, 300 mA, ±20%, 1.08 Ω	0402
L2, L3	4.7 nH	Inductor, 400 mA, ±3%, 250 mΩ	0201
L4	2.0 nH	Inductor, 600 mA, ±0.1 nH, 120 mΩ	0201
U1	nRF54L15-CAAA	Multiprotocol Bluetooth Low Energy, IEEE 802.15.4, and 2.4GHz proprietary System on Chip	CSP47
X1	32.768 kHz	Crystal SMD 2012, 32.768 kHz, Cl = 9 pF, Total tol: ±20 ppm	XTAL_2012
X2	32 MHz	Crystal SMD 1612, 32 MHz, Cl = 8 pF, Total Tol: ±40 ppm, Aging ±1 ppm/year. For frequency tolerance requirements, see 32 MHz crystal oscillator (HFXO).	XTAL_1612

PCB layout example

The PCB layout in the following figure is a reference layout for Circuit configuration no. 1 for QFAA QFN48.

Note: Pay attention to how the capacitor C6 is grounded. It is not directly connected to the ground plane, but grounded via pin 32 and to the VSS die pad. This is done to create additional filtering of harmonic components.

For all available reference layouts, see the product page for nRF54L15/10/05 on www.nordicsemi.com.

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