Package thermal characteristics
A summary of the thermal characteristics for the different packages available for the device can be found below.
| Symbol | Package | Typ. | Unit |
|---|---|---|---|
| θJA,QFN48 | QFN48 | 24.86 | °C/W |
| θJC,QFN48 | QFN48 | 12.71 | °C/W |
| θJA,CSP47 | CSP47 | 83.84 | °C/W |
| θJC,CSP47 | CSP47 | 7.82 | °C/W |
Values for θJA are obtained by simulation following the EIA/JESD51-2 for still air condition using JEDEC PCB.
Values for θJC are obtained by simulation. A cold plate and the grease between package and cold plate are modeled.