Absolute maximum ratings

Maximum ratings are the extreme limits to which the chip can be exposed for a limited amount of time without permanently damaging it. Exposure to absolute maximum ratings for prolonged periods of time may affect the reliability of the device.

For accelerated lifetime testing (HTOL, etc.), supply voltage should not exceed the recommended operating conditions max value, see Recommended operating conditions.

Table 1. Supply voltage
	Parameter	Min.	Max.	Unit
VDD	VDD supply voltage	-0.3	3.9	V
VDD_EXT	VDD supply voltage under extended operating temperature	-0.3	3.7	V

Table 2. I/O pin voltage
	Parameter	Min.	Max.	Unit
V_I/O, VDD ≤3.6 V	IO voltage	-0.3	VDD + 0.3	V
V_I/O, VDD >3.6 V	IO voltage	-0.3	3.9	V
V_I/O,EXT, VDD_EXT ≤3.4 V	IO voltage under extended operating temperature	-0.3	VDD + 0.3	V
V_I/O,EXT, VDD_EXT >3.4 V	IO voltage under extended operating temperature	-0.3	3.7	V

Table 3. Radio
	Min.	Max.	Unit
RF input level		10	dBm

Table 4. Environmental QFN™ package types
	Note	Min.	Max.	Unit
Storage temperature		-40	+125	°C
Reflow soldering temperature	Reflow cycle time is 30 seconds with 3 maximum reflow cycles.		260	°C
Moisture Sensitivity Level (MSL)			2
ESD Human Body Model (HBM)			1	kV
ESD Charged Device Model (CDM)			500	V

Table 5. Environmental CSP package types
	Note	Min.	Max.	Unit
Storage temperature	Recommended storage condition is < 40°C and < 90% RH (relative humidity)	-40	+125	°C
Reflow soldering temperature	Reflow cycle time is 30 seconds with 3 maximum reflow cycles.		260	°C
Moisture Sensitivity Level (MSL)			1
ESD Human Body Model (HBM)			3	kV
ESD Charged Device Model (CDM)			250	V

Table 6. RRAM memory
	Min.	Unit
Endurance	10,000	Write/rewrite cycles
Retention at 85°C	10	y
Retention at 105°C	2	y