CSP light sensitivity

All CSP package variants are sensitive to visible and close-range infrared light. This means that a final product design must shield the chip properly, either by final product encapsulation or by shielding/coating of the CSP device.

All CSP package variants have a backside coating, where the marking side of the device is covered with a light absorbing film, while the side edges and the ball side of the device are still exposed and need to be protected.