Package thermal characteristics
A summary of the thermal characteristics for the different packages available for the device can be found below.
| Symbol | Package | Typ. | Unit |
|---|---|---|---|
| θJA,CSP | CSP98 | 34.94 | °C/W |
| θJC,CSP | CSP98 | 8.16 | °C/W |
Values for θJA are obtained by simulation following the EIA/JESD51-2 for still air condition using JEDEC PCB.
Values for θJC are obtained by simulation. A cold plate and the grease between package and cold plate are modeled.