Light sensitivity

Some package types are sensitive to visible and close-range infrared light. For those packages, the final product design must shield the device properly, either by encapsulation or by shielding or coating of the package. Other package types are not light sensitive and do not require such protection.

Of the package options for the nRF54LM20A and nRF54LM20B devices, only the wafer-level CSP (WLCSP) package is light sensitive. WLCSP packages have a backside coating, where the marking side of the device is covered with a light absorbing film, but the side edges and the ball side remain exposed and must be protected in the final product by encapsulation or shielding/coating of the CSP device.

Flip-chip CSP (FCCSP) packages and Quad Flat No-lead (QFN) packages are not light sensitive.