Reference circuitry

To ensure good RF performance when designing PCBs, it is highly recommended to use the PCB layouts and component values provided by Nordic Semiconductor.

Documentation for the different package reference circuits, including Altium Designer files, PCB layout files, and PCB production files can be downloaded from www.nordicsemi.com.

In this section, there are reference circuits for all product variants, showing the components and component values to support on-chip features in a design.

Circuit configuration 1 for CSP29 (CAAA)

In addition to the schematic, the bill of material (BOM) is also provided.

Note: The matching network for the radio is preliminary and is subject to change.

For PCB reference layouts, see the product page for the nRF54LV10A on www.nordicsemi.com.

Table 1. Bill of material for circuit configuration no. 1

Designator	Value	Description	Footprint
C1, C4	10 µF	Capacitor, X6S, ±20%, 6.3 V	0402
C2, C5	100 nF	Capacitor, X7R, ±10%, 100 nF, 10 V	0201
C3	1.0 µF	Capacitor, Ceramic, X5R, ±20%, 6.3 V	0201
C6	4.7 µF	Capacitor, Ceramic, X5R, ±20%, 6.3 V	0201
C7	1.2 pF	Capacitor, NP0, ±0.05 pF, 50 V	0201
C8	0.8 pF	Capacitor, NP0, ±0.05 pF, 50 V	0201
C9	0.3 pF	Capacitor, C0G, ±0.1 pF, 50V	0201
C10, C13	2.2 µF	Capacitor, Ceramic, 2.2 µF 2.5V X6T 0201,±20%	0201
C11	10 nF	Capacitor, X7R, 6.3 V	0201
C12	18 pF	Capacitor, C0G, ±5%, 25V	0201
FB1, FB2	120 Ω	Ferrite bead, 120 Ω at 100 MHz, 200 mA, 500 mΩ max	0201
L1	4.7 µH	Inductor, 300 mA, ±20%, 1.08 Ω	0402
L2	2.7 nH	Inductor, 600 mA, ±0.1ｎH, 120 mΩ	0201
L3	6.2 nH	Inductor, 400 mA, ±3%, 250 mΩ	0201
L4	4.3 nH	Inductor, 500 mA, ±3%, 170 mΩ	0201
U1	nRF54LV10A-CAAA	Multiprotocol Bluetooth® Low Energy, IEEE 802.15.4, and 2.4GHz proprietary System on Chip	CSP29
X1	32 MHz	XTAL SMD 1612, 32MHz, Cl=8pF, Tot: ±40ppm, Aging: ±1ppm/year	XTAL_1612

Circuit configuration 1 for QFN48 (QFAA)

In addition to the schematic, the bill of material (BOM) is also provided.

Note: The matching network for the radio is preliminary and is subject to change.

Note: For PCB reference layouts, see the product page for the nRF54LV10A on www.nordicsemi.com.

Table 2. Bill of material for circuit configuration no. 1

Designator	Value	Description	Footprint
C1, C4	10 µF	Capacitor, X6S, ±20%, 6.3 V	0402
C2, C5	100 nF	Capacitor, X7R, ±10%, 100 nF, 10 V	0201
C3	1.0 µF	Capacitor, Ceramic, X5R, ±20%, 6.3 V	0201
C6	4.7 µF	Capacitor, Ceramic, X5R, ±20%, 6.3 V	0201
C7	1.5 pF	Capacitor, NP0, ±0.05 pF, 25 V	0201
C8	2.0 pF	Capacitor, NP0, ±0.05 pF, 25 V	0201
C9	0.3 pF	Capacitor, C0G, ±0.1pF, 50V	0201
C10	2.2 µF	Capacitor, X6T, ±20%, 2.5V	0201
C11, C12	10 nF	Capacitor, X7R, 6.3 V	0201
FB1	120 Ω	Ferrite bead, 120 Ω at 100 MHz, 200 mA, 500 mΩ max	0201
L1	4.7 µH	Inductor, 120 mA, ±20%, 0.65 Ω	0603
L2	2.7 nH	Inductor, 600 mA, ±0.1ｎH, 120 mΩ	0201
L3, L4	3.5 nH	Inductor, 500 mA, ±3%, 170 mΩ	0201
U1	nRF54LV10A-QFAA	Multiprotocol Bluetooth Low Energy, IEEE 802.15.4, and 2.4GHz proprietary System on Chip	QFN-48
X1	32 MHz	XTAL SMD 1612, 32MHz, Cl=8pF, Tot: ±40ppm, Aging: ±1ppm/year	XTAL_1612
X2	32.768 kHz	XTAL SMD 2012, 32.768 kHz, 9 pF, ±20 ppm	XTAL_2012

PCB layout example

The PCB layout in the following figure is a reference layout for Circuit configuration 1 for CSP29 (CAAA).

For all available reference layouts, see the product page for nRF54LV10A on www.nordicsemi.com.